- 300W Hot air rework station with automatic cooling system.
- LED digital display, showing current temperature and status.
- MCU confirms fast heat up, accurate and stable control on temperature.
- Temperature range: 100-500°C.
- Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA.
- Includes three nozzles.
1 year
